Vibration characteristic researching of capillary of ultrasonic wire bonding

Wuwei Feng 

Department of Ship and Ocean Engineering, Zhejiang Ocean University, Zhoushan, 316022, China

Wire bonding, a process of the connection between a semiconductor chip and a lead frame by a thin metal wire, is one of the important processes of electronic packaging. Vibration characteristic and friction behaviour of capillary of Microelectronic Packaging ultrasonic bonding system are studied. A dynamic contact model of capillary was built by finite element method to gain bonding mechanism of wire bonding system. Vibration response and contact friction property of the capillary are calculated. The effects of the loading frequency and static compressive force to the vibration response and contact friction stress were obtained, and the relationships between the loading frequency, the static compressive force and the vibration response were given. The researching conclusions can be used as references for having a better understanding of the bonding mechanism and the study of fault diagnose techniques for bonding process.