Effect of 3-S-isothiuronium propyl sulfonate on bottom-up filling in copper electroplating

Qiuxian Shen, Xu Wang

COMPUTER MODELLING & NEW TECHNOLOGIES 2015 19(2D) 23-25

College of Science, Lishui University, Lishui 323000, China

The effect of 3-S-isothiuronium propyl sulfonate (UPS) upon the microholes filling by Cu electrodeposition was investigated by cross-sectional images using optical microscopy. The bottom-up filling of the electroplating bath was achieved with an addition of UPS. The electrochemical study indicated that the polarisation on the cathode was decreased with an addition of UPS. Furthermore, X-ray diffraction analyses showed the crystallography and the peak intensity ratio I(111)/I(200) of plated Cu film were decreased with addition of UPS. The results present UPS as an accelerator which is beneficial for microholes filling for high density interconnections printed circuit board.